Back End of Line

Increase your chip production volume with zero-defect quality and boost customer satisfaction.

Our combinable 2D and 3D analysis systems considerably improve quality assurance by inspecting all chips individually and assessing integrated circuit packaging. Integrated at the interface between front and back end, ISRA inspection systems detect defects in individual components at the wafer level and in the dicing frame. Due to 100% inspection, it is ensured that only flawless material is sent to customers.

Internal Cracks

Inspection of bulk wafer material for defects and micro cracks – only flawless wafers are conveyed

Dicing Street Inspection

100 % inspection of the front and rear sides of the dicing street

Metrology at Wafer & Die Level

Inspecting the surface finish of wafers and individual dies