Internal Cracks

Preventing unnecessary downtimes and intricate machine cleaning processes: ISRA’s optical inspection systems precisely detect defects like micro cracks on the bulk wafer material. This ensures that only flawless wafers reach the next production steps. Integrated and automated defect classification also supports troubleshooting. 

Inline Surface Inspection for Detecting Internal Cracks

Our patented detection methods uncover defects inside the wafer that cannot be detected microscopically. 

Inline Surface Inspection of Wafer Edges

During rotation the sensor scans the wafer edge from three perspectives, thus ensuring defect detection to the outermost edge of the wafer.