Metrology at Wafer & Die Level
High-precision 3D surface metrology for integrated circuit packaging measures the flatness, roughness, planarity and step heights of wafers and individual chips down to the nanometer range.
3D Inspection of Reflective Surfaces
Deflectometric 3D sensors serve to inspect the planarity of reflective surfaces at nanometer level – in a quick, precise, and cost-effective manner.
3D Inspection for Surface Measurement
3D sensors (high-precision, white-light interferometers) for surface measurement. With telecentric optics, nanometer resolutions, a high working distance and a wide adjustment range in the Z axis, our sensors are particularly well suited to the optical measurement of flatness, step height and parallelism.