Wafer Production

Boost your yield while ensuring maximum quality and process reliability, even in ongoing wafer production.

Our optical inline inspection systems reliably detect micro cracks and substantially increase your production capacity. Due to the early detection of defects like etching residues on the front, rear and edge of the wafers, you can save costs by removing defective material before it reaches the next stage in the production process.

Surface Defects

100% inline inspection, even at high speeds – detect and classify macroscopic defects precise and reliable

Internal Cracks

Inspection of bulk wafer material for defects and micro cracks – only flawless wafers are conveyed

Edge Defects

Detect edge defects with highest precision and reduce downtime of the processing machines considerably

Surface Topology

Inspect and document maximum height deviations and wafer surface curvature using deflectometric 3D inspection