Excellent quality assurance in wafer production: Our edge sensor detects damage on the wafer edge in the back end of line. This allows for precise identification of defects like etching residues, along with mechanical defects like cracks or chippings. As a result, defective wafers can be removed from the production line early on, preventing unnecessary machine downtime and ensuring that customers receive flawless wafers. Additionally, the integrated and automated defect classification supports troubleshooting procedures.
Inline Surface Inspection of Wafer Edges
During rotation the sensor scans the wafer edge from three perspectives, thus ensuring defect detection to the outermost edge of the wafer.