WAF-Q solutions are powered by
Stop-and-Go measurement technology: surface, geometry, and contour inspection
Wafer sizes from M6 to M12
Scalable resolutions for highest accuracy requirements from 4MP to 25MP
Seamless integration into Connected PV for central recipe management and factory defect yield and effect overview
Incoming wafer control for full wafer, half-cut wafer and triple-cut wafer: WAF-Q reliably detects visual defects such as fingerprints, stains, surface chippings, and other visible surface defects while also checking dimensional features (edge lengths, angles, chamfer lengths, chamfer angles) and contour defects (intrusions, V-Breaks, Breakage, chamfer breakage).
With its multi-image capturing technology, the system is capable of reliably detecting even low-contrast defects, providing 100% monitoring of wafer production. Based on the data collected, the wafers and cells are then classified into different quality classes.
Wafer and Cell
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Industriestraße 14
64297
, Darmstadt
germany
Frankfurter Straße 112, 64293 Darmstadt, Germany +49 (6151) 948-0 [email protected]