Back End Process

Wafer Level Bonding

The downsizing of electronic devices is challenging semiconductor manufacturers to produce smaller component sizes while maintaining tighter process control requirements.

ISRA VISION's wafer inspection solutions for advanced wafer-level packaging ensure traceability throughout the semiconductor manufacturing process. Our systems provide superior quality control for improved device performance, enabling manufacturers to detect, resolve and monitor process deviations in a timely manner.

Benefits

Efficiency: simultaneous scanning of the bulk wafer material, and the wafer edge

Flexibility: seamless integration into existing process lines

Increased uptime: minimize wafer breakage during processing

Features, typical defects and technical data

Features

Reliable defect detection and classification
Defect detection down to <5 µm crack width
Wafer mapping / 2D coordination map
Throughput: up to 180 wph
Edge inspection tool integrated into pre-aligner

Typical defects

Microcracks inside the bulk wafer material

Edge chippings
Cracks near edge
Edge contaminations

Technical data

High-resolution line scan cameras with LED line illumination using different wavelengths
Integrated adjustment of thresholds and crack characteristics for sensitive optimization of the detection result
Typ. resolution: 20 μm, optional down to 1.5 μm
Semi standard interface

Download additional information

CrackScan brochure en 311.6 kB, PDF
EdgeScan brochure en 464.7 kB, PDF
CrackScan brochure cn 488.1 kB, PDF
EdgeScan brochure cn 523.6 kB, PDF

Discover our solutions - Re-Thinning

Back end process

Re-Thinning

Re-thinning can introduce defects on the wafer's surface that can impact the performance and functionality of the final semiconductor device.

Therefore, optical inspection after re-thinning is crucial to detect defects that could impact device functionality.

Conducting optical inspection after the re-thinning process allows manufacturers to minimize the risk of defects and ensure that the final semiconductor devices meet the required performance and reliability standards. This helps to enhance the overall quality and yield of the semiconductor manufacturing process.

Benefits

Efficiency: simultaneous scanning of bulk and surface at line speeds of up to 180 wafers/hour

Flexibility: seamless integration into existing process lines

Increased uptime: minimize wafer breakage during processing

Customized, seamless integration into wafer handling solutions

100% control of the re-thinned wafer edge in parallel to other process steps - no influence on existing cycle times

Features, typical defects and technical data

Features

Reliable defect detection and classification
Defect detection down to <5 µm crack width
Wafer mapping / 2D coordination map
Process control of cracks/chip-outs at the re-thinned wafer edge
Throughput: up to 180 wph
Edge inspection tool integrated into pre-aligner

Typical defects

Microcracks inside the bulk wafer material
Edge chippings
Cracks near edge
Contaminations

Technical data

High-resolution line scan cameras with LED line illumination using different wavelengths
Integrated adjustment of thresholds and crack characteristics for sensitive optimization of the detection result
Typ. resolution for microcrack inspection: 20 μm, optional down to 1.5 μm
Pixel resolution for edge inspection: typ. 3 μm/px
Integration with thin wafer handling
Semi standard interface

Download additional information

CrackScan brochure en 311.6 kB, PDF
EdgeScan brochure en 464.7 kB, PDF
CrackScan brochure cn 488.1 kB, PDF
EdgeScan brochure cn 523.6 kB, PDF

Discover our solutions - Post-Dicing Inspection

Back end process

Post-Dicing Inspection 100% inspection of dicing streets in semiconductor manufacturing

Dicing wafers carries the risk of defects in the dicing streets. Accurate inspection of the dicing street reliably detects these defects and minimizes the scrap rate of chips and dies. The DicingScan inspection tool provides 100% wafer inspection. High-performance line scan cameras precisely detect defects such as edge chippings in the dicing streets. In addition, the tool checks the presence, position, and completeness of the dicing streets.

With our patented MultiView imaging technology, which forms the basis of the WafQScan process, users can also inspect the rear side of the wafer through the carrier tape (foil). DicingScan ensures that only dies/chips of impeccable quality are processed.

Benefits

Features, typical defects and technical data

Features

Dicing street inspection immediately after dicing
(Micro-)crack inspection on dies
Check the position, integrity, and quality of dicing strees
Front and rear side inspection, even through the carrier tape

Typical defects

Uncompleted dicing
Cracks
Bubbles
Releases
Chip-outs

Technical data

MultiView technology with simultaneous image capturing
Semi standard interface

Discover our solutions - Service & Training

Back end process