Achieve higher yields, enhanced traceability, and faster ROI with zero-defect quality chip production: Our combinable 2D and 3D analysis systems significantly improve quality assurance by inspecting all chips individually and evaluating the integrated circuit packaging. Integrated at the interface between the front-end and back-end, ISRA inspection systems detect defects in individual components at the wafer level and in the dicing frame. This 100% inspection ensures that only flawless material is sent to the customer.
The downsizing of electronic devices is challenging semiconductor manufacturers to produce smaller component sizes while maintaining tighter process control requirements.
ISRA VISION's wafer inspection solutions for advanced wafer-level packaging ensure traceability throughout the semiconductor manufacturing process. Our systems provide superior quality control for improved device performance, enabling manufacturers to detect, resolve and monitor process deviations in a timely manner.
Re-thinning can introduce defects on the wafer's surface that can impact the performance and functionality of the final semiconductor device.
Therefore, optical inspection after re-thinning is crucial to detect defects that could impact device functionality.
Conducting optical inspection after the re-thinning process allows manufacturers to minimize the risk of defects and ensure that the final semiconductor devices meet the required performance and reliability standards. This helps to enhance the overall quality and yield of the semiconductor manufacturing process.
Dicing wafers carries the risk of defects in the dicing streets. Accurate inspection of the dicing street reliably detects these defects and minimizes the scrap rate of chips and dies. The DicingScan inspection tool provides 100% wafer inspection. High-performance line scan cameras precisely detect defects such as edge chippings in the dicing streets. In addition, the tool checks the presence, position, and completeness of the dicing streets.
With our patented MultiView imaging technology, which forms the basis of the WafQScan process, users can also inspect the rear side of the wafer through the carrier tape (foil). DicingScan ensures that only dies/chips of impeccable quality are processed.
Für den effizienten und zukunftssicheren Betrieb Ihrer Produktionsanlagen unterstützen Sie unsere hochqualifizierten Serviceteams weltweit in allen Belangen. Wir übernehmen die Implementierung, Wartung und Instandhaltung sowie die Analyse und Optimierung Ihrer Anlagen - schnell, zuverlässig, 24/7.
Darüber hinaus erfahren Sie in der ISRA Academy, wie unsere kompetenten Trainer Ihre Mitarbeiter immer auf dem aktuellen Wissensstand halten, damit Anlagenbediener, Produktingenieure und Qualitätsmanager zu echten Inspektionsexperten werden.