Increase yield while ensuring the highest quality and process reliability, even in ongoing wafer production.
Our inline optical inspection systems reliably detect defects on the surface, at the edge and inside the bulk wafer material to significantly increase your production capacity. Save costs by removing defective material before it reaches the next stage of the production process.
CMP eliminates micro peaks and valleys.
However, microcracks in the bulk wafer material or at the wafer edge can lead to wafer breakage during polishing or other downstream processes, resulting in high costs. Defective wafers must be rejected in time to avoid expensive cleaning and extended machine downtime.
Features
Typical defects
Technical data
Improve production yields with 100% in-line inspection, even at high inspection speeds. Using patented MultiView technology, our systems reliably identify and classify macro defects, handling scratches or etch residues. This allows defective wafers to be removed from the process at an early stage.
Features
Typical defects
Technical data
Wafer planarity is essential for perfect assembly. SpecGAGE3D is a compact solution for efficient quality inspection of reflective surfaces. Using deflectometry, height deviations, and defects are reliably detected in a single measurement.
The measurement data is compared to the CAD data, and differences are evaluated within seconds. The system quickly and efficiently determines whether the manufactured wafers are within the required dimensional tolerances. This enables users to minimize production waste while optimizing processes and machine settings.
Integrated into fully automated production lines, SpecGAGE3D permanently improves the process and reduces production costs.
Typical defects
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Director Sales SEMI-EL
Hainbuchenring 9-11
82061
, Neuried
germany