This page shows all inspection solutions for wafer production

Inspection solutions for the wafer production

Increased uptime

Increased efficiency

Increased yield

Wafer production

Increase yield while ensuring the highest quality and process reliability, even in ongoing wafer production.

Our inline optical inspection systems reliably detect defects on the surface, at the edge and inside the bulk wafer material to significantly increase your production capacity. Save costs by removing defective material before it reaches the next stage of the production process.

Discover our solutions for the Wafer Production

Post-Grinding / Pre-Polishing Inspection

Final Quality / End-of-line Inspection

Surface Topology Inspection

Service & Training

Post-Grinding / Pre-Polishing Inspection

CMP eliminates micro peaks and valleys.

However, microcracks in the bulk wafer material or at the wafer edge can lead to wafer breakage during polishing or other downstream processes, resulting in high costs. Defective wafers must be rejected in time to avoid expensive cleaning and extended machine downtime.

Benefits

Increased uptime: Microcrack detection minimizes wafer breakage during the polishing process

Efficiency: Simultaneous scanning of bulk and surface at line speeds of up to 180 wafers/hour

Flexibility: Seamless integration into existing process lines

Features, typical defects and technical data

Features

Defect detection down to <5 µm crack width
Wafer mapping / 2D coordination map
Inspection of the wafer edge from three perspectives
Scan speed: Up to 130°/sec
Optional notch inspection

Typical defects

Chippings
Micro-cracks
Etch residuals
Scratches on the front and rear side
Crystal defects (twin-lamella)

Technical data

High-resolution line scan cameras with LED line illumination using different wavelengths
Integrated adjustment of thresholds and crack characteristics for sensitive optimization of the detection result
Typ. resolution: 20 μm, optional down to 1,5 μm
Optical Setup for edge inspection: 2 × 45° prisms & direct side view for 3-sided image acquired
Semi standard interface

Avoid unnecessary downtime in your semiconductor production

Using ISRA VISIONs unique inspection technology wafer breakage in the polishing machine is significantly minimized, preventing unnecessary downtimes in process machinery. By removing wafers with critical defects from the production process the CrackScan and EdgeScan inspection systems have been proven to increase productivity.

Discover why a spezialized semiconductor producer and technology leader has chosen the inspection solutions from ISRA VISION to optimize his production.

Download case study

Download additional information

CrackScan brochure en 311.6 kB, PDF
EdgeScan brochure en 464.7 kB, PDF
EdgeScan brochure cn 523.6 kB, PDF
CrackScan brochure cn 488.1 kB, PDF

Discover our solutions - Final Quality / End-of-line Inspection

Post-Grinding / Pre-Polishing Inspection

Final Quality / End-of-line Inspection

Surface Topology Inspection

Service & Training

Final Quality / End-of-line Inspection

Improve production yields with 100% in-line inspection, even at high inspection speeds. Using patented MultiView technology, our systems reliably identify and classify macro defects, handling scratches or etch residues. This allows defective wafers to be removed from the process at an early stage.

Benefits

Defect detection in a wide range of coating and lamination techniques

Continuous and complete process control

Defects detection on both sides of the web

Checking of register accuracy

Features, typical defects and technical data

Features

Defect detection on wafer surfaces and wafer edges
Rear side inspection (non-functional side)
Front side inspection for GaAs (relaxed requirements)
Automatic defect classification
Optional notch inspection

Typical defects

Scratches on the front and rear side
Etch pits („round“ polished) on the front side
Etch defects esp. on the rear side
Etch residuals
Edge chippings

Technical data

High-resolution line scan cameras
Highest throughput 50 -100 wph (appl. dep.)
MultiView technology with adapted wavelength and resolution
Pixel resolution: typ. 3 μm/px
Semi standard interface

Download additional information

WafQScan brochure en 233 kB, PDF
EdgeScan brochure en 464.7 kB, PDF
WafQScan brochure cn 339.6 kB, PDF
EdgeScan brochure cn 523.6 kB, PDF

Discover our solutions - Surface Topology Inspection

Post-Grinding / Pre-Polishing Inspection

Final Quality / End-of-line Inspection

Surface Topology Inspection

Service & Training

Surface Topology Inspection Form control and defect detection for bare and sapphire wafers

Wafer planarity is essential for perfect assembly. SpecGAGE3D is a compact solution for efficient quality inspection of reflective surfaces. Using deflectometry, height deviations, and defects are reliably detected in a single measurement.

The measurement data is compared to the CAD data, and differences are evaluated within seconds. The system quickly and efficiently determines whether the manufactured wafers are within the required dimensional tolerances. This enables users to minimize production waste while optimizing processes and machine settings.

Integrated into fully automated production lines, SpecGAGE3D permanently improves the process and reduces production costs.